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Chip and Wire Bonder

HPCareers
Job LocationBaildon
EducationNot Mentioned
Salary27,000 - 30,000 per annum
IndustryNot Mentioned
Functional AreaNot Mentioned
Job TypePermanent , full-time

Job Description

Chip & Wire Bonder

  • Salary circa £27,000pa (but negotiable for the right experience)
  • Full-time permanent role
  • Shipley Location
  • Excellent benefits
  • Training and development opportunities
HPCareers are now recruiting for an experienced Chip & Wire Bonder within our clients cleanroom operation. You will be working for an award-winning international design and manufacturing business, with opportunities for career development.Duties:
  • Hand assembly of electronic devices using soldering, epoxy and bonding techniques.
  • Working to process specifications, manufacturing instructions, and required standards as determined by the product design.
  • Meet requirements of line and audit inspection to maintain AS9100 and ISO9001 requirements.
  • Follow written, pictorial and verbal working instructions from Engineers and other team members.
  • Highlight any re-work issues and record all failures as required by TD&S company operating procedures
  • Work with the Engineering team and Operations Support Engineering team during the redesign and new product introduction.
  • Work with the Operations Test teams and ensure smooth flow of product is maintained.
  • Participate in Continuous Improvement activities and any new working initiatives.
  • Report any problems with materials or equipment to their Operations management team.
  • Assist with training new operators as required.
  • Contribute to and support all the lean manufacturing techniques including 5S, Kaizen, KANBAN etc.
Required Experience:
  • Bonding techniques - Wire and Tape bond to chips / Die Attach components using Epoxy
  • Electronics production and cleanroom environment
  • Following procedures, instructions, and specifications.

Keyskills :
ElectronicsEpoxySMTSoldering IronWire Bonding

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