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| Job Location | Sedgefield |
| Education | Not Mentioned |
| Salary | Salary negotiable |
| Industry | Not Mentioned |
| Functional Area | Not Mentioned |
| Job Type | Permanent, full-time |
A job as a Packaging Engineer is urgently required in Sedgefield, Stockton-On-Tees.An exciting new job has arisen for a Packaging Engineer, based in Sedgefield, Stockton-On-Tees to work for an world leader in the design and manufacture of custom RF, microwave and millimetre wave components and subsystems. The Packaging Engineer, located in Sedgefield, Stockton-On-Tees will be responsible for the backend semiconductor process. They will lead the packaging assembly technology development across the business, to enhance the package design capability, to deliver advanced, integrated solutions.The ideal Packaging Engineer, based in Sedgefield, Stockton-On-Tees will have experience in the semiconductor or compound semiconductor package manufacturing processes, specifically the wafer bumping, flip-chip, wire-bond, Underfill, SMT and other packaging technologies.APPLY NOW! For the Packaging Engineer job, located Sedgefield, Stockton-On-Tees by sending a cover letter and CV to or by calling Tom Drew on quoting ref. THD7143/55. Otherwise we always welcome the opportunity to discuss other roles similar to Process Engineering jobs on . Required skills
Keyskills :
Packaging Semiconduct Back-end Process Flip chip wafer bumping wire-bond Underfill