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| Job Location | London |
| Education | Not Mentioned |
| Salary | Salary negotiable |
| Industry | Not Mentioned |
| Functional Area | Not Mentioned |
| Job Type | Permanent, full-time |
JOB AD:SUMMARY DESCRIPTION:- Under limited supervision leads failure analysis activities related to the design, manufacture, and reliability of ASICs- Supports new product introductions as well as supporting root cause analysis on customer returns of products in mass production- Must be comfortable analyzing all factors of foundry process and circuit design problems and presenting concise results to all levels of audiences.- Assignments are varied and require a results-driven approach, must be driven to investigate root cause of failures and work in team environment to determine corrective actions- Candidate must be detail-oriented and willing to work in a fast-paced environment- Assist with "change implementation" and the objective to transition the organization from a reactive to a proactive culture to better meet internal and external customer requirements- Interact with functional groups at all levels (manufacturing, sales, marketing, etc.), to address and resolve critical product and customer issues- Actively seek out and utilize technical expertise from within the company and from outside sources to assist in problem solving- Develop new Failure Analysis procedures and tools then proliferate to the global Failure Analysis team for alignment- Determine how appropriate test screens should be implemented based on physical failure mechanism and data analysis- Prepare technical reports- Communicate suggestions to appropriate R&D, Test Development, Product Engineering, or management team in an effective and appropriate mannerPOSITION REQUIREMENTS:- Bachelor of Science degree in Electrical Engineering or equivalent- Strong technical background in semiconductor processing is required.- Experience with electronics packaging, and acoustics is preferred.- Minimum 5 years of experience in electronic components or assemblies- High level analytical and problem-solving abilities are a must- Ability to travel internationally is required- Familiarity with Audio Analyzers, Minitab, IC micro-probing and analysis techniques such as SEM, EDX, OBIRCH, FIB, TEM, TOF-SIMS, FTIR is a plus.- Must have excellent oral and written communication skills- Software skills including MS Office, Excel, statistical analysis and graphing are required