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| Job Location | Ipswich |
| Education | Not Mentioned |
| Salary | Salary negotiable |
| Industry | Not Mentioned |
| Functional Area | Not Mentioned |
| Job Type | Contract, full-time |
JOB AD:Day and Nights Shift OperatorsLocation: IpswichDuration: 1 yearStart date: ASAPShift Operators2 shifts: 06.00 - 14.00 one week followed by 14.00 - 22.00 the following week, Monday - Friday, 37.5 hours per week (30-minute unpaid break)3% Pension25 days holiday + 8 public holidays£11.74 per hour/ Salary: £22,800Night Shift OperatorsNight shift: Sunday - Thursday, 22.00 - 06.00, 37.5 hours per week (30-minute unpaid break)3% Pension25 days holiday + 8 public holidays. (paid)£13 per hour/ Salary: £25,000A client based in Ipswich is looking for several Operators to work either day shifts or night shift. This for an initial 1-year contract.Role:The Operators role is to be part a Technical team delivering design, projects, and products to customers within set parameters and time frames.The role is based within clean room and laboratory conditions where tasks will follow documented instructions and specifications in an ISO9001 controlled environment.Processing material through a range of hi-tech fabrication, test and validation tools that enable CIP to produce advanced optoelectronic research components.These processes will operate under either Engineering or Production control with the appropriate support and training provided.Uphold rigorous: Safety, Quality and Environmental standards to ensure safe and efficient working practices.Learn, understand, and follow controlled documented standards of Operating Procedure, equipment set-up use and maintenance.Skills:Experience of working in a technical environment, with excellent attention to detail and manual dexterity.Proven ability to follow design drawings and specifications, recording process data as required.Demonstrable relevant experience in device fabrication in some of the following.Photolithography, wet etching, RIE etching, metal and dielectric deposition, wafer thinning, cleaving and dicing, facet coating, die and wire bonding, validation & reliability packaging and testing.