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Job Location | Cambridge |
Education | Not Mentioned |
Salary | Competitive salary |
Industry | Not Mentioned |
Functional Area | Not Mentioned |
Job Type | Permanent, full-time |
Are you enthusiastic about new technologies This position is an excellent opportunity for an expert and highly motivated package design engineer to join the Package Design team and work on the future of System-in-Package designs, focusing on finding theoptimum implementations that will improve Arm IP performance. The semiconductor industry transitioned from multichip modules, then to SoC and is now moving into sophisticated System-in-Package (SiP) which changes the influence of Arm IP. Arm IP will beginto span multiple pieces of silicon in a system and optimizing this interaction is important for internal development and enabling partner successResponsibilities:The Package design engineer will be in charge of drawing novel System-in-Package designs. State of the art power delivery techniques and interfaces will be key in emerging technologies as advanced packaging is growing in industry importance. The engineerwill be responsible for the definition, design, and verification of package designs. Candidate will work closely with teams in France, US, UK, and other ARM locations on need basis. Candidate will interact with digital designers (P&R) on the inputs and constraintsto build efficient designs, and also interact with SI/PI engineers. Clear communication with other team members is important. The job will be based out of Cambridge or Sophia Arm premises.Required Skills and Experience :